KUALA LUMPUR, July 18 (Bernama) -- Polyplastics Co Ltd is utilizing computer-aided engineering (CAE) analysis to forecast parts deformation during the reflow process of manufacturing connector parts made of liquid crystal polymer (LCP).
The LCP connectors are using in mobile devices such as smartphones and switches, along with automotive-related applications.
Since heat deformation can cause poor bonding, it is important to find ways to reduce heat deformation, particularly as the market sees growing demand for smaller connectors.
In response, Polyplastics looked to CAE and began considering design-stage deformation forecasting for molded articles in the reflow process., a statement said.
Polyplastics has identified three stages of deformation -- post-molding initial deformation (warpage), at-peak heat deformation and post-cooling deformation -- that can be forecasted by CAE analysis.
With more than 50 years of experience, the company is a leading global supplier of engineering thermoplastics.
--BERNAMA
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